K4P2G324ED

The K4P2G324ED is a 2 G-bit dynamic random access memory (DRAM) integrated circuit (IC) manufactured by the Samsung Corporation. It has a 168-pin fine ball grid array stacked die (FBGA-SD) package, which is stacked on top of the processor to save wiring space. Commonly known as package-on-package (PoP) technology, it saves a huge amount of board space and PCB complexity.

Applications

Used on the Raspberry Pi computer board, it stacks on top of the Broadcom system on chip (SoC) processor. When stacked in this manner, they form a multi chip package (MCP). The stacking option can be a pyramid or the same die.

This memory is for battery powered mobile devices and is therefore very small and consumes extremely little power. Since mobile devices operate on battery power, this particular memory is low power DDR (LPDDR).

Samsung is the best and the largest provider of high performance memory to the electronics industry. This particular memory has the smallest form factor and is therefore ideal for mobile devices.