Palm V PCB & IC Components

The Palm V printed circuit board (PCB) manufacturing is to high specifications. The internal battery occupies almost half of the enclosure space, leaving very little for the circuit. Consequently, this is a multi-layered PCB, and the processor package is a Ball Grid Array (BGA) type.

Compared to the Palm Vx PCB, there is a slight difference to the main component layout. In addition, the flash ROM IC, next to the DRAM, has a BGA package.

8 MB Memory Upgrade - Resistor Location

For the Palm V 8 MB memory upgrade, there is a small cluster of resistors that will require relocation.

Please see enlarged image for the resistor location.

Resistor Relocation

The SMD resistors are extremely small, and even with a pair of tweezers they are very difficult to work with. The animated image shows exactly which resistors require moving.

Although this was impressive technology for 2001, you will be amazed with the latest technological advancements. The Samsung Mega has one of the most powerful processors ever designed and is a marvel of miniaturisation.

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